Two component (1:1 ratio), 100-percent solids, high aspect ceramic blend, solvent-free, non-sag, high strength, high modulus, moisture insensitive epoxy system. Ideal for use as a bonding agent for almost any material, including metal, concrete, brick, wood, stone, block and other substrates. Can also be used for repairing holes, spalls, cracks in concrete, repairing rotted wood, installing and repairing anchor bolts or hand rails. LIMITATIONS: Minimum substrate and ambient temperature 35 degrees F (1.67degrees C), do not thin with solvents this will prevent cure; if preparing epoxy mortar, use oven dried silica sand only and maximum epoxy mortar thickness per lift is 1 inch (25mm). Cartridge With Nozzle.